A study of wireless inter-chip interconnect

A study of wireless inter-chip interconnect

In semiconductor industry, device feature dimension has been continuously scaled down to reduce device size and to improve circuit performance. In parallel with the device feature dimension down scaling, the width and thickness of wire interconnect have been reduced. On the other hand, to integrate...

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Bibliographic Details
Main Author: Chen, Zhiming
Other Authors: Zhang Yue Ping
Format: Thesis
Language:English
Published: 2008
Subjects:
DRNTU::Engineering::Electrical and electronic engineering::Antennas, wave guides, microwaves, radar, radio
DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits
Online Access:https://hdl.handle.net/10356/14559

Internet

https://hdl.handle.net/10356/14559

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