A study of wireless inter-chip interconnect
In semiconductor industry, device feature dimension has been continuously scaled down to reduce device size and to improve circuit performance. In parallel with the device feature dimension down scaling, the width and thickness of wire interconnect have been reduced. On the other hand, to integrate...
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| Format: | Thesis |
| Language: | English |
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2008
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| Online Access: | https://hdl.handle.net/10356/14559 |
| _version_ | 1826129058422849536 |
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| author | Chen, Zhiming |
| author2 | Zhang Yue Ping |
| author_facet | Zhang Yue Ping Chen, Zhiming |
| author_sort | Chen, Zhiming |
| collection | NTU |
| description | In semiconductor industry, device feature dimension has been continuously scaled down to reduce device size and to improve circuit performance. In parallel with the device feature dimension down scaling, the width and thickness of wire interconnect have been reduced. On the other hand, to integrate more functions together, chip size continues growing. Therefore, the down-scaled wire interconnect has to route over an ever increasing chip area, implying degraded interconnect performance. As a matter of fact, performance of interconnects rather than device has become a bottleneck of ICs system performance. With improved radio frequency silicon technologies and higher-degree integration, wireless interconnect, which realizes wireless communications among cores within a chip or different chips within a module, is a viable candidate for solving problems in future generations of interconnects. |
| first_indexed | 2024-10-01T07:34:33Z |
| format | Thesis |
| id | ntu-10356/14559 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T07:34:33Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/145592023-07-04T17:00:29Z A study of wireless inter-chip interconnect Chen, Zhiming Zhang Yue Ping School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Antennas, wave guides, microwaves, radar, radio DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits In semiconductor industry, device feature dimension has been continuously scaled down to reduce device size and to improve circuit performance. In parallel with the device feature dimension down scaling, the width and thickness of wire interconnect have been reduced. On the other hand, to integrate more functions together, chip size continues growing. Therefore, the down-scaled wire interconnect has to route over an ever increasing chip area, implying degraded interconnect performance. As a matter of fact, performance of interconnects rather than device has become a bottleneck of ICs system performance. With improved radio frequency silicon technologies and higher-degree integration, wireless interconnect, which realizes wireless communications among cores within a chip or different chips within a module, is a viable candidate for solving problems in future generations of interconnects. DOCTOR OF PHILOSOPHY (EEE) 2008-12-16T09:19:07Z 2008-12-16T09:19:07Z 2008 2008 Thesis Chen, Z. (2008). A study of wireless inter-chip interconnect. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/14559 10.32657/10356/14559 en 179 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering::Antennas, wave guides, microwaves, radar, radio DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits Chen, Zhiming A study of wireless inter-chip interconnect |
| title | A study of wireless inter-chip interconnect |
| title_full | A study of wireless inter-chip interconnect |
| title_fullStr | A study of wireless inter-chip interconnect |
| title_full_unstemmed | A study of wireless inter-chip interconnect |
| title_short | A study of wireless inter-chip interconnect |
| title_sort | study of wireless inter chip interconnect |
| topic | DRNTU::Engineering::Electrical and electronic engineering::Antennas, wave guides, microwaves, radar, radio DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits |
| url | https://hdl.handle.net/10356/14559 |
| work_keys_str_mv | AT chenzhiming astudyofwirelessinterchipinterconnect AT chenzhiming studyofwirelessinterchipinterconnect |