A study of wireless inter-chip interconnect
In semiconductor industry, device feature dimension has been continuously scaled down to reduce device size and to improve circuit performance. In parallel with the device feature dimension down scaling, the width and thickness of wire interconnect have been reduced. On the other hand, to integrate...
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| Format: | Thesis |
| Language: | English |
| Published: |
2008
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| Online Access: | https://hdl.handle.net/10356/14559 |