Ceramic-polymer composites for electronic packaging
This project aims to develop a high thermal conductive material capable of being used for electronic packaging to combat the challenges such as overheating in electronic devices resulting from limits of miniaturization and increase in packing density of transistors. The highly isotropic thermal p...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
Nanyang Technological University
2021
|
| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/147870 |