Effect of high temperature aging on the performance of nanoCu sintered joints
Harsh environment electronics need to maintain their functionality while working at conditions such as under high current density, high operating frequency and high working temperature for power electronics devices. To realise the favourable performance of such devices, the package and assembly tech...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
Nanyang Technological University
2021
|
| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/147872 |