Fine pitch packaging study of CU or low-k devices
The main objective of this project is to improve and enhance the reliability performance of Cu / low-k flip chip ball grid array packages. This project is divided into three parts. The first part of the project involved developing an underfill selection methodology that enable researchers to screen...
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| Format: | Thesis |
| Language: | English |
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2009
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| Online Access: | http://hdl.handle.net/10356/14975 |