Carbon nanostructures dedicated to millimeter-wave to THz interconnects

Carbon nanostructures dedicated to millimeter-wave to THz interconnects

This paper focuses on the use of CNTs for new mm-to-THz interconnects for nanopackaging. To successfully integrate CNT to be in line with nanoelectronics trends, new growth processes and modeling approaches are proposed. Several experimental works are presented such as millimeter-wave flip-chip bond...

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Bibliographic Details
Main Authors: Brun, Christophe, Tan, Chong Wei, Franck, Pierre, Chong, Yap Chin, Lu, Congxiang, Leong, Chow Wai, Tan, Dunlin, Tay, Beng Kang, Coquet, Philippe, Baillargeat, Dominique
Other Authors: School of Electrical and Electronic Engineering
Format: Journal Article
Language:English
Published: 2021
Subjects:
Engineering::Electrical and electronic engineering
Carbon Nanotubes
Electromagnetic Modeling
Online Access:https://hdl.handle.net/10356/151171

Internet

https://hdl.handle.net/10356/151171

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