Interfacial study of electroless Ni-Sn-P plating and Sn-3.5Ag solder after multiple reflows

Interfacial study of electroless Ni-Sn-P plating and Sn-3.5Ag solder after multiple reflows

Electroless Ni-P plating has been a good candidate for Under Bump Metallization (UBM) in IC packaging due to its lower cost and slower chemical reaction with solder compared to Cu based UBM. However, during its reaction with Sn-based lead free solder, it faces the problem of rapid Ni out diffusion w...

Full description

Bibliographic Details
Main Author: Sumboja, Afriyanti.
Other Authors: Chen Zhong
Format: Final Year Project (FYP)
Language:English
Published: 2009
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Online Access:http://hdl.handle.net/10356/15307

Internet

http://hdl.handle.net/10356/15307

Similar Items