Organic monolayers for room temperarture copper bonding
Wafer level bonding process is a key fabrication step in many integration systems including microelectromechanical (MEMs) and nanoelectromechanical (NEMs). Often harsh bonding conditions used during process, result in large thermomechanical stresses built-up that leads to undesired degradation in de...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2009
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| Online Access: | http://hdl.handle.net/10356/15340 |