Bonding for 3D ICs and heterogeneous system
In the current two-dimensional (2D) integrated circuits, the chip size is increasing despite the reduction in feature size. This leads to increased complexity of chip design as more and more transistors are closely packed. Hence, three-dimensional technology is the solution. In general, 3D technolog...
| 主要作者: | |
|---|---|
| 其他作者: | |
| 格式: | Final Year Project (FYP) |
| 语言: | English |
| 出版: |
2009
|
| 主题: | |
| 在线阅读: | http://hdl.handle.net/10356/15350 |