Thermal conductivity of AlN-cordierite composite for microelectronic packaging
The ongoing pursuit of improving the performance of microelectronics constantly increases the demands for better heat dissipation capability of the packagings which house these electronic devices. Besides heat dissipation, other factors such as the dielectric constant, processing temperature and...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2009
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| Online Access: | http://hdl.handle.net/10356/15429 |