Thermal conductivity of AlN-cordierite composite for microelectronic packaging
The ongoing pursuit of improving the performance of microelectronics constantly increases the demands for better heat dissipation capability of the packagings which house these electronic devices. Besides heat dissipation, other factors such as the dielectric constant, processing temperature and...
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| Other Authors: | |
| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2009
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| Online Access: | http://hdl.handle.net/10356/15429 |
| _version_ | 1826111029184036864 |
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| author | Chua, Jonathan Loy Pang. |
| author2 | Oh, Joo Tien |
| author_facet | Oh, Joo Tien Chua, Jonathan Loy Pang. |
| author_sort | Chua, Jonathan Loy Pang. |
| collection | NTU |
| description | The ongoing pursuit of improving the performance of microelectronics constantly
increases the demands for better heat dissipation capability of the packagings which
house these electronic devices. Besides heat dissipation, other factors such as the
dielectric constant, processing temperature and coefficient of thermal expansion also
need to be considered where selecting an effective packaging material.
A composite consisting of Aluminium Nitride and Cordierite could in theory meet all
of the above requirements. This project involved the characterization of the
microstructure and thermal conductivity of a set of samples consisting of varying
amounts of Aluminium Nitride and Cordierite.
Increasing amounts of Aluminium Nitride generally increased the thermal
conductivity of the composite for Aluminium Nitride content lesser than 60%. At
60% Aluminium Nitride content, there is a drop in thermal conductivity. This is
followed by a subsequent increase in thermal conductivity in the last sample
containing 70% Aluminium Nitride.
It was observed that these changes in thermal conductivity with Aluminium Nitride
and Cordierite content were linked to the microstructure and thermal conduction
pathways within the composite. A transition in the continuous phase of the composite
from Cordierite to Aluminium Nitride was linked to the drop in thermal conductivity
at 60% Aluminium Nitride content. The completion of this transition at higher
Aluminium Nitride content led to a subsequent increase in thermal conductivity of the
composite. |
| first_indexed | 2024-10-01T02:43:54Z |
| format | Final Year Project (FYP) |
| id | ntu-10356/15429 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T02:43:54Z |
| publishDate | 2009 |
| record_format | dspace |
| spelling | ntu-10356/154292023-03-04T15:41:16Z Thermal conductivity of AlN-cordierite composite for microelectronic packaging Chua, Jonathan Loy Pang. Oh, Joo Tien School of Materials Science and Engineering DRNTU::Engineering::Materials::Composite materials The ongoing pursuit of improving the performance of microelectronics constantly increases the demands for better heat dissipation capability of the packagings which house these electronic devices. Besides heat dissipation, other factors such as the dielectric constant, processing temperature and coefficient of thermal expansion also need to be considered where selecting an effective packaging material. A composite consisting of Aluminium Nitride and Cordierite could in theory meet all of the above requirements. This project involved the characterization of the microstructure and thermal conductivity of a set of samples consisting of varying amounts of Aluminium Nitride and Cordierite. Increasing amounts of Aluminium Nitride generally increased the thermal conductivity of the composite for Aluminium Nitride content lesser than 60%. At 60% Aluminium Nitride content, there is a drop in thermal conductivity. This is followed by a subsequent increase in thermal conductivity in the last sample containing 70% Aluminium Nitride. It was observed that these changes in thermal conductivity with Aluminium Nitride and Cordierite content were linked to the microstructure and thermal conduction pathways within the composite. A transition in the continuous phase of the composite from Cordierite to Aluminium Nitride was linked to the drop in thermal conductivity at 60% Aluminium Nitride content. The completion of this transition at higher Aluminium Nitride content led to a subsequent increase in thermal conductivity of the composite. Bachelor of Engineering (Materials Engineering) 2009-04-29T08:03:22Z 2009-04-29T08:03:22Z 2009 2009 Final Year Project (FYP) http://hdl.handle.net/10356/15429 en 43 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Materials::Composite materials Chua, Jonathan Loy Pang. Thermal conductivity of AlN-cordierite composite for microelectronic packaging |
| title | Thermal conductivity of AlN-cordierite composite for microelectronic packaging |
| title_full | Thermal conductivity of AlN-cordierite composite for microelectronic packaging |
| title_fullStr | Thermal conductivity of AlN-cordierite composite for microelectronic packaging |
| title_full_unstemmed | Thermal conductivity of AlN-cordierite composite for microelectronic packaging |
| title_short | Thermal conductivity of AlN-cordierite composite for microelectronic packaging |
| title_sort | thermal conductivity of aln cordierite composite for microelectronic packaging |
| topic | DRNTU::Engineering::Materials::Composite materials |
| url | http://hdl.handle.net/10356/15429 |
| work_keys_str_mv | AT chuajonathanloypang thermalconductivityofalncordieritecompositeformicroelectronicpackaging |