Electrical component classification using 2D and 3D semantic segmentation
Description: The student will focus on 2D/3D semantic segmentation on various semiconductor component, such as TSV, logic bump, memory bump etc. The objective is to detect defects in the buried interconnects inside the chip by detecting and identifying the above structures. It involves 2D/3D data pr...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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Nanyang Technological University
2022
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| Online Access: | https://hdl.handle.net/10356/158187 |