Non-destructive evaluation and defect detection studies on silicon wafer samples using laser shearography
The aim of this project is to use a non-destructive testing method, laser shearography, to examine defects in silicon wafers and composites. Soon after manufacturing, in the testing and inspection phase, parts are examined for defects. Non-destructive Testing (NDT) is used for examining, and tes...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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Nanyang Technological University
2022
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| Online Access: | https://hdl.handle.net/10356/159064 |