LTspice implementation of PKU compact model of metal-oxide-based RRAM: part C_simulation of RRAM memory arrays

RRAM, which has the characteristics of high speed, low power consumption, easy integration, compatibility with CMOS technology, is a potential NVM technology. It is considered as the next-generation high density storage and high-performance computing technology, and also, a powerful alternative of f...

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Main Author: Du, Yifan
Other Authors: Chen Tupei
Format: Thesis-Master by Coursework
Language:English
Published: Nanyang Technological University 2022
Subjects:
Online Access:https://hdl.handle.net/10356/159456
_version_ 1826121644156911616
author Du, Yifan
author2 Chen Tupei
author_facet Chen Tupei
Du, Yifan
author_sort Du, Yifan
collection NTU
description RRAM, which has the characteristics of high speed, low power consumption, easy integration, compatibility with CMOS technology, is a potential NVM technology. It is considered as the next-generation high density storage and high-performance computing technology, and also, a powerful alternative of flash memory technology. In this dissertation, we first briefly reviewed several mainstream memory technologies, including the volatile memory (or random access memory) technologies represented by SRAM and DRAM and the non-volatile memory technology represented by flash memory. Aiming at many shortcomings of flash technology, we listed three NMV technologies which are considered as alternatives to traditional NAND and NOR flash memory, including PCRAM, STT-MRAM and RRAM. In chapter 2, we discussed the basic principles of RRAM, especially the memristor, which is a fourth class of electrical circuit, joining the resistor, the capacitor, and the inductor. Also we briefly analyzed how different memristor or electrode materials and RRAM cell structures affect performance. In chapter 3 we built models based on Stanford-PKU RRAM model and 0.18um TSMC N-MOSFET. The simulation results of the RRAM cell model, the 1T1R RRAM structure model and 1T1R RRAM array model are analyzed in chapter 4. Based on the simulation results, methods are proposed to solve the problem occurring during the SPICE code running with the LTspice simulator.
first_indexed 2024-10-01T05:35:35Z
format Thesis-Master by Coursework
id ntu-10356/159456
institution Nanyang Technological University
language English
last_indexed 2024-10-01T05:35:35Z
publishDate 2022
publisher Nanyang Technological University
record_format dspace
spelling ntu-10356/1594562023-07-04T17:51:05Z LTspice implementation of PKU compact model of metal-oxide-based RRAM: part C_simulation of RRAM memory arrays Du, Yifan Chen Tupei School of Electrical and Electronic Engineering EChenTP@ntu.edu.sg Engineering::Electrical and electronic engineering::Electronic circuits RRAM, which has the characteristics of high speed, low power consumption, easy integration, compatibility with CMOS technology, is a potential NVM technology. It is considered as the next-generation high density storage and high-performance computing technology, and also, a powerful alternative of flash memory technology. In this dissertation, we first briefly reviewed several mainstream memory technologies, including the volatile memory (or random access memory) technologies represented by SRAM and DRAM and the non-volatile memory technology represented by flash memory. Aiming at many shortcomings of flash technology, we listed three NMV technologies which are considered as alternatives to traditional NAND and NOR flash memory, including PCRAM, STT-MRAM and RRAM. In chapter 2, we discussed the basic principles of RRAM, especially the memristor, which is a fourth class of electrical circuit, joining the resistor, the capacitor, and the inductor. Also we briefly analyzed how different memristor or electrode materials and RRAM cell structures affect performance. In chapter 3 we built models based on Stanford-PKU RRAM model and 0.18um TSMC N-MOSFET. The simulation results of the RRAM cell model, the 1T1R RRAM structure model and 1T1R RRAM array model are analyzed in chapter 4. Based on the simulation results, methods are proposed to solve the problem occurring during the SPICE code running with the LTspice simulator. Master of Science (Electronics) 2022-06-20T04:48:06Z 2022-06-20T04:48:06Z 2022 Thesis-Master by Coursework Du, Y. (2022). LTspice implementation of PKU compact model of metal-oxide-based RRAM: part C_simulation of RRAM memory arrays. Master's thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/159456 https://hdl.handle.net/10356/159456 en application/pdf Nanyang Technological University
spellingShingle Engineering::Electrical and electronic engineering::Electronic circuits
Du, Yifan
LTspice implementation of PKU compact model of metal-oxide-based RRAM: part C_simulation of RRAM memory arrays
title LTspice implementation of PKU compact model of metal-oxide-based RRAM: part C_simulation of RRAM memory arrays
title_full LTspice implementation of PKU compact model of metal-oxide-based RRAM: part C_simulation of RRAM memory arrays
title_fullStr LTspice implementation of PKU compact model of metal-oxide-based RRAM: part C_simulation of RRAM memory arrays
title_full_unstemmed LTspice implementation of PKU compact model of metal-oxide-based RRAM: part C_simulation of RRAM memory arrays
title_short LTspice implementation of PKU compact model of metal-oxide-based RRAM: part C_simulation of RRAM memory arrays
title_sort ltspice implementation of pku compact model of metal oxide based rram part c simulation of rram memory arrays
topic Engineering::Electrical and electronic engineering::Electronic circuits
url https://hdl.handle.net/10356/159456
work_keys_str_mv AT duyifan ltspiceimplementationofpkucompactmodelofmetaloxidebasedrrampartcsimulationofrrammemoryarrays