Large-scale fabrication of surface ion traps on a 300 mm glass wafer
Herein, a large-scale fabrication of radio frequency (RF) surface ion traps on a 300 mm glass wafer using a standard foundry process is reported. Established wafer-level packaging process of electroplated Cu with Au finish is used to fabricate the surface electrodes directly on the glass wafer subst...
Main Authors: | , , , , , , , , |
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Other Authors: | |
Format: | Journal Article |
Language: | English |
Published: |
2022
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/160357 |