Realization of three-dimensionally MEMS stacked comb structures for microactuators using low-temperature multi-wafer bonding with self-alignment techniques in CMOS-compatible processes

Realization of three-dimensionally MEMS stacked comb structures for microactuators using low-temperature multi-wafer bonding with self-alignment techniques in CMOS-compatible processes

A high-aspect-ratio three-dimensionally (3D) stacked comb structure for micromirror application is demonstrated by wafer bonding technology in CMOS-compatible processes in this work. A vertically stacked comb structure is designed to circumvent any misalignment issues that could arise from multiple...

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Bibliographic Details
Main Authors: Teo, Adrian J. T., Li, Holden King Ho
Other Authors: School of Mechanical and Aerospace Engineering
Format: Journal Article
Language:English
Published: 2022
Subjects:
Engineering::Mechanical engineering
3D MEMS
Wafer Bonding
Online Access:https://hdl.handle.net/10356/160535

Internet

https://hdl.handle.net/10356/160535

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