Realization of three-dimensionally MEMS stacked comb structures for microactuators using low-temperature multi-wafer bonding with self-alignment techniques in CMOS-compatible processes
A high-aspect-ratio three-dimensionally (3D) stacked comb structure for micromirror application is demonstrated by wafer bonding technology in CMOS-compatible processes in this work. A vertically stacked comb structure is designed to circumvent any misalignment issues that could arise from multiple...
| Main Authors: | , |
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| Format: | Journal Article |
| Language: | English |
| Published: |
2022
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/160535 |