Thermally conductive and leakage-proof phase-change materials composed of dense graphene foam and paraffin for thermal management

Practical implementation of porous carbon-based composite phase-change materials (CPCMs) for heat dissipation in high-power-density electronics is usually limited by liquid leakage issues and unsatisfactory thermal conductivity resulting from their relatively low filler fraction and/or existence of...

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Bibliographic Details
Main Authors: Li, Hongling, Tay, Roland Yingjie, Tsang, Siu Hon, Hubert, Romain, Coquet, Philippe, Merlet, Thomas, Foncin, Jerome, Yu, Jong Jen, Teo, Edwin Hang Tong
Other Authors: School of Electrical and Electronic Engineering
Format: Journal Article
Language:English
Published: 2022
Subjects:
Online Access:https://hdl.handle.net/10356/163380