Thermal shock resistance enhancement by improved interfacial bonding for carbon/aluminium composites

Thermal shock resistance enhancement by improved interfacial bonding for carbon/aluminium composites

Carbon/aluminium (C/Al) composites have the advantages of low density and high electrical conductivity, which have potential applications in aerospace, rail transportation and other fields. However, the unstable bonding of the C/Al interface and significant thermal expansion differences have resulte...

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Bibliographic Details
Main Authors: Wei, Wenfu, Huang, Zhanglin, Yin, Guofeng, Yang, Zefeng, Li, Xiaobo, Zuo, Haozi, Deng, Qin, Huang, Guizao, Ren, Junwen, Liao, Qianhua, Yang, Yan, Wu, Guangning
Other Authors: School of Electrical and Electronic Engineering
Format: Journal Article
Language:English
Published: 2023
Subjects:
Engineering::Electrical and electronic engineering
Composite Failure
Thermal Shock Resistance
Online Access:https://hdl.handle.net/10356/164340

Internet

https://hdl.handle.net/10356/164340

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