Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times

Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times

Much attention has been drawn to the Ni-Sn transient liquid phase (TLP) bonded joints for high-temperature electronic packaging applications since their inception. A comparative study of Ni-Sn TLP bonded joints with different interlayers was conducted. The evolution of microstructure and mechanical...

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Bibliographic Details
Main Authors: Yan, Guangxu, Gill, Vincent, Gan, Chee Lip, Chen, Zhong
Other Authors: School of Materials Science and Engineering
Format: Journal Article
Language:English
Published: 2023
Subjects:
Engineering::Materials
Microstructure
Mechanical Properties
Online Access:https://hdl.handle.net/10356/164395

Internet

https://hdl.handle.net/10356/164395

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