Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times
Much attention has been drawn to the Ni-Sn transient liquid phase (TLP) bonded joints for high-temperature electronic packaging applications since their inception. A comparative study of Ni-Sn TLP bonded joints with different interlayers was conducted. The evolution of microstructure and mechanical...
| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2023
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/164395 |
| _version_ | 1811687124964999168 |
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| author | Yan, Guangxu Gill, Vincent Gan, Chee Lip Chen, Zhong |
| author2 | School of Materials Science and Engineering |
| author_facet | School of Materials Science and Engineering Yan, Guangxu Gill, Vincent Gan, Chee Lip Chen, Zhong |
| author_sort | Yan, Guangxu |
| collection | NTU |
| description | Much attention has been drawn to the Ni-Sn transient liquid phase (TLP) bonded joints for high-temperature electronic packaging applications since their inception. A comparative study of Ni-Sn TLP bonded joints with different interlayers was conducted. The evolution of microstructure and mechanical properties of joints with different bonding times was also investigated. In addition, the high-temperature (300 °C) thermal reliability of the Ni-Sn TLP bonded joints was explored with aging times from 0 h to 100 h. The results show that electroplated Ni-Sn TLP bonded joints exhibited a slightly higher average shear strength than those prepared using Sn foil and Sn96.5Ag3.5 paste. Also, the average shear strength of the electroplated Ni-Sn TLP bonded joints was greatly improved when the bonding time increased from 0.5 h to 5 h, while there was a continuous decrease in the average shear strength as the aging time was increased from 4 h to 100 h. During aging, the Ni/Ni3Sn2 interface was the preferential site for the nucleation of newly formed Ni3Sn2 intermetallic compounds (IMCs). Furthermore, the cross-sectional microstructure of the shear fractured joints after aging from 4 h to 100 h indicates that the shear fractures propagated through both the Ni3Sn4 IMCs and the Ni3Sn2/Ni3Sn4 interface. |
| first_indexed | 2024-10-01T05:11:20Z |
| format | Journal Article |
| id | ntu-10356/164395 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T05:11:20Z |
| publishDate | 2023 |
| record_format | dspace |
| spelling | ntu-10356/1643952023-07-14T16:07:18Z Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times Yan, Guangxu Gill, Vincent Gan, Chee Lip Chen, Zhong School of Materials Science and Engineering Rolls-Royce@NTU Corporate Laboratory Engineering::Materials Microstructure Mechanical Properties Much attention has been drawn to the Ni-Sn transient liquid phase (TLP) bonded joints for high-temperature electronic packaging applications since their inception. A comparative study of Ni-Sn TLP bonded joints with different interlayers was conducted. The evolution of microstructure and mechanical properties of joints with different bonding times was also investigated. In addition, the high-temperature (300 °C) thermal reliability of the Ni-Sn TLP bonded joints was explored with aging times from 0 h to 100 h. The results show that electroplated Ni-Sn TLP bonded joints exhibited a slightly higher average shear strength than those prepared using Sn foil and Sn96.5Ag3.5 paste. Also, the average shear strength of the electroplated Ni-Sn TLP bonded joints was greatly improved when the bonding time increased from 0.5 h to 5 h, while there was a continuous decrease in the average shear strength as the aging time was increased from 4 h to 100 h. During aging, the Ni/Ni3Sn2 interface was the preferential site for the nucleation of newly formed Ni3Sn2 intermetallic compounds (IMCs). Furthermore, the cross-sectional microstructure of the shear fractured joints after aging from 4 h to 100 h indicates that the shear fractures propagated through both the Ni3Sn4 IMCs and the Ni3Sn2/Ni3Sn4 interface. National Research Foundation (NRF) Submitted/Accepted version The work was investigated with the support of Rolls-Royce@NTU Corporate Laboratory, Nanyang Technological University and the National Research Foundation (NRF). 2023-01-20T03:08:11Z 2023-01-20T03:08:11Z 2022 Journal Article Yan, G., Gill, V., Gan, C. L. & Chen, Z. (2022). Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times. Materials Characterization, 194, 112452-. https://dx.doi.org/10.1016/j.matchar.2022.112452 1044-5803 https://hdl.handle.net/10356/164395 10.1016/j.matchar.2022.112452 2-s2.0-85142451539 194 112452 en Materials Characterization © 2022 Elsevier Inc. All rights reserved. This paper was published in Materials Characterization and is made available with permission of Elsevier Inc.. application/pdf |
| spellingShingle | Engineering::Materials Microstructure Mechanical Properties Yan, Guangxu Gill, Vincent Gan, Chee Lip Chen, Zhong Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times |
| title | Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times |
| title_full | Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times |
| title_fullStr | Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times |
| title_full_unstemmed | Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times |
| title_short | Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times |
| title_sort | microstructure and mechanical properties of electroplated ni sn tlp bonded joints with different bonding and aging times |
| topic | Engineering::Materials Microstructure Mechanical Properties |
| url | https://hdl.handle.net/10356/164395 |
| work_keys_str_mv | AT yanguangxu microstructureandmechanicalpropertiesofelectroplatednisntlpbondedjointswithdifferentbondingandagingtimes AT gillvincent microstructureandmechanicalpropertiesofelectroplatednisntlpbondedjointswithdifferentbondingandagingtimes AT gancheelip microstructureandmechanicalpropertiesofelectroplatednisntlpbondedjointswithdifferentbondingandagingtimes AT chenzhong microstructureandmechanicalpropertiesofelectroplatednisntlpbondedjointswithdifferentbondingandagingtimes |