Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times
Much attention has been drawn to the Ni-Sn transient liquid phase (TLP) bonded joints for high-temperature electronic packaging applications since their inception. A comparative study of Ni-Sn TLP bonded joints with different interlayers was conducted. The evolution of microstructure and mechanical...
Main Authors: | Yan, Guangxu, Gill, Vincent, Gan, Chee Lip, Chen, Zhong |
---|---|
Other Authors: | School of Materials Science and Engineering |
Format: | Journal Article |
Language: | English |
Published: |
2023
|
Subjects: | |
Online Access: | https://hdl.handle.net/10356/164395 |
Similar Items
-
The study of Ni-Sn transient liquid phase bonded joints under high temperatures
by: Yan, Guangxu, et al.
Published: (2023) -
Microstructural Evolution of the TLP Joints of RAFM Steel during Aging and Creep
by: Kun Liu, et al.
Published: (2022-08-01) -
Microstructure and mechanical properties of TLP-bonded 9CrMoCoB heat-resistant steel with Ni–Cr–B interlayer
by: Yingjun Jiao, et al.
Published: (2022-01-01) -
High temperature resistant aging stability of lead-free solder joints by TLP bonding
by: LI Zheng-bing, et al.
Published: (2021-10-01) -
Effect of bonding and aging temperatures on bond strengths of Cu with 75Sn25In solders
by: Thompson, Carl V., et al.
Published: (2010)