Ceramic pin grid array with built-in interconnects to locate TSV integrated ion trap for wire bonding-free assembly

Ceramic pin grid array with built-in interconnects to locate TSV integrated ion trap for wire bonding-free assembly

To alleviate the heat dissipation issue of through silicon via (TSV) integrated ion trap on glass interposer, a ceramic pin grid array (CPGA) with built-in redistribution layer (RDL) is demonstrated to locate the trap directly. This patterned RDL has internal connection to the backside CPGA pin, fac...

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Bibliographic Details
Main Authors: Zhao, Peng, Li, Hong Yu, Lim, Yu Dian, Hu, Liangxing, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng
Other Authors: School of Electrical and Electronic Engineering
Format: Conference Paper
Language:English
Published: 2023
Subjects:
Engineering::Electrical and electronic engineering::Electronic packaging
Advanced Integration
Ceramic Pin Ggrid Array
Online Access:https://hdl.handle.net/10356/166180

Internet

https://hdl.handle.net/10356/166180

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