Deep-learning based IC die identification and die surface defect inspection
Much effort is needed when detecting faults in semiconductors during the manufacturing process. With the rise of artificial intelligence to enhance processes, many would wonder how it is incorporated with semiconductor technologies. However, as a substantial amount of training data is required for t...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
Nanyang Technological University
2023
|
| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/166704 |