Deep-learning based IC die identification and die surface defect inspection

Deep-learning based IC die identification and die surface defect inspection

Much effort is needed when detecting faults in semiconductors during the manufacturing process. With the rise of artificial intelligence to enhance processes, many would wonder how it is incorporated with semiconductor technologies. However, as a substantial amount of training data is required for t...

書誌詳細
第一著者:	Teo, Kai Yu
その他の著者:	Qian Kemao
フォーマット:	Final Year Project (FYP)
言語:	English
出版事項:	Nanyang Technological University 2023
主題:	Engineering::Computer science and engineering
オンライン･アクセス:	https://hdl.handle.net/10356/166704

類似資料

Machine learning based image analysis for surface defect inspection
著者:: Lee, Yong Xian
出版事項: (2023)

Defect-GAN : high-fidelity defect synthesis for automated defect inspection
著者:: Zhang, Gongjie, 等
出版事項: (2021)

Artificial neural networks for voltage-frequency prediction using on-die measurements
著者:: Kannan, Ponmithiran
出版事項: (2023)

Deep learning for defect detection
著者:: Low, Edwin Xuan Hao
出版事項: (2023)

Automated visual inspection of IC packages
著者:: U Maung Maung Thet
出版事項: (2008)

Pembilang Acuan Dan Pemeriksaan Bentuk (Die Counter And Shape Inspection)
著者:: Mat Nawang, Bazli
出版事項: (2006)

Deep learning based mental health/status interpretation
著者:: Teo, Guang Xiang
出版事項: (2023)

On-die signal integrity monitoring of gigabit serial I/Os
著者:: Moore, Alexander Wyatt
出版事項: (2008)

An efficient approach for vision inspection of IC chips
著者:: Kok Wah, Liew
出版事項: (2012)

Soldering defect detection in automatic optical inspection
著者:: Dai, Wenting, 等
出版事項: (2020)

Towards automatic optical inspection of soldering defects
著者:: Dai, Wenting, 等
出版事項: (2020)

Proposed intelligent algorithm for IC marking image inspection
著者:: H., Yasser, 等
出版事項: (2011)

FHENet: lightweight feature hierarchical exploration network for real-time rail surface defect inspection in RGB-D images
著者:: Zhou, Wujie, 等
出版事項: (2023)

Training deep network models for accurate recognition of texts in scenes
著者:: Teo, Zhi Kai
出版事項: (2022)

Die-level glass frit vacuum packaging for a micro-fuel processor system
著者:: Cheung, Kerry
出版事項: (2006)

Machine learning based image analysis for surface defect detection
著者:: Htet Thiri Zaw
出版事項: (2024)

Image processing and machine learning for IC image analysis and hardware assurance
著者:: Cheng, Deruo
出版事項: (2021)

Demand forecasting on time series with external correlation using deep learning techniques
著者:: Teo, Boon Shuan
出版事項: (2021)

Evaluation of machine learning classifiers in faulty die prediction to maximize cost scrapping avoidance and assembly test capacity savings in semiconductor integrated circuit (IC) manufacturing
著者:: Mohd Fazil, Azlan Faizal, 等
出版事項: (2019)

An Overview of Laser Surface Modification of Die Steels
著者:: S. N., Aqida
出版事項: (2008)

Unsupervised surface defect detection using deep autoencoders and data augmentation
著者:: Abdul Mujeeb, 等
出版事項: (2020)

Experimental Investigation of Thermal Fatigue Die Casting Dies by Using Response Surface Modelling
著者:: Hassan Abdulrssoul, Abdulhadi, 等
出版事項: (2017)

Testing a closed loop forming algorithm on a part created by discrete die stretch forming
著者:: Grodzinsky, Mark S. (Mark Sean)
出版事項: (2008)

Deep learning based methods for low-resolution person re-identification
著者:: Sebastian, Jason
出版事項: (2021)

Person re-identification using visual analytic and deep learning
著者:: Tay, Chiat Pin
出版事項: (2022)

Thermal Fatigue of Die-Casting Dies: An Overview
著者:: Hassan, A. Abdulhadi, 等
出版事項: (2016)

Semantic segmentation of delayered IC images with shape-variant convolution
著者:: Wang, Xue
出版事項: (2022)

Pavement defect detection with deep convolutional neural network
著者:: Chan, Zhen Yi
出版事項: (2023)

Deep learning feature-based visual SLAM
著者:: Yong, Duan Kai
出版事項: (2023)

Remote microscope for inspection of integrated circuits
著者:: Kao, James T. (James Ting Yu)
出版事項: (2005)

Make biometric-based person identification system applicable
著者:: Teo, Lay Hoon.
出版事項: (2013)

Analog-digital co-existence in 3D-IC
著者:: Yahalom, Gilad
出版事項: (2016)

Neural architectures for faster deep learning-based collaborative filtering
著者:: Chen, Yu
出版事項: (2021)

Deep learning-based image captioning
著者:: Chong, Kaydon
出版事項: (2019)

Nondestructive evaluation interfaces defects IC packaging
著者:: Guo, Ningqun., 等
出版事項: (2008)

Deep learning-based information extraction
著者:: Lu, Hui
出版事項: (2023)

Gesture recognition based on deep learning
著者:: Yang, Chaoran
出版事項: (2023)

Deep learning in computer chess
著者:: Zhao, Yu
出版事項: (2023)

Efficient IC statistical modeling and extraction using a Bayesian inference framework
著者:: Yu, Li, Ph. D. Massachusetts Institute of Technology
出版事項: (2015)

Thermal simulation of laser surface processing for hot forming die surface hardening
著者:: Hanna, Mustafa
出版事項: (2013)