Investigation of mechanical stress-induced failure in transfer-bonded vertically aligned carbon nanotube arrays
As society increasingly embraces the digital world, technological progress is inevitable. With the proliferation of technology, the demand for advanced electronic devices that are both high-performing and portable is rising. This presents a challenge in terms of protecting these devices from elec...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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Nanyang Technological University
2023
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| Online Access: | https://hdl.handle.net/10356/167396 |