Experimental study on the thermal characteristics of a 3D thermosyphon heat sink
Phase change heat transfer has received extensive attention in the thermal management of electronic devices. Most studies of heat pipe or vapor chamber were limited to one- or two-dimensional heat transfer mode. Enhancing the phase change heat transfer to three-dimensional mode in heat sinks and exp...
| Main Authors: | , , , , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2023
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/169010 |