Simplified Assembly of Through-Silicon-Via Integrated Ion Traps

Simplified Assembly of Through-Silicon-Via Integrated Ion Traps

The scalability of surface electrode ion traps has been progressively improved with the on-chip integration of conventionally bulk components. Based on the development of through silicon via (TSV) integrated ion trap, in this work, we further simplify the back-end assembly process by patterning...

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Bibliographic Details
Main Authors: Zhao, Peng, Li, Hong Yu, Likforman, Jean-Pierre, Henner, Theo, Lim, Yu Dian, Hu, Liang Xing, Seit, Wen Wei, Luca, Guidoni, Tan, Chuan Seng
Other Authors: School of Electrical and Electronic Engineering
Format: Journal Article
Language:English
Published: 2023
Subjects:
Engineering::Electrical and electronic engineering::Microelectronics
Ceramic Pin Grid Array
Redistribution Layer
Surface Electrode Ion Trap
Through-Silicon Vias
Online Access:https://hdl.handle.net/10356/170177

Internet

https://hdl.handle.net/10356/170177

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