Flexible and printable composite ink for thermalmanagement of soft electronics
Since heat generation in electronic devices causes thermal failure, heat dissipation is of critical importance. Furthermore, deformable devices are subjected to mechanical stress, therefore, mechanically stable thermal management material should be considered. Herein, a strategy for printable, therm...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2023
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/170875 |