Measurement of residual stress developed during advanced semiconductor packaging process
This research report provides a focused investigation and theoretical review of thermal mismatch induced residual stress in semiconductor assembly and the application of utilizing piezoresistive stress sensor to conduct nondestructive measurement of such stress. In semiconductor fabrication process...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2009
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/17302 |