Hardware security assessment through repair of damaged device
In this paper, the feasibility of content access to physically damaged electronic device was explored by performing package level repair through transplantation of its intact silicon chip from its faulty substrate package onto another functional one, and establishment of new electrical connections b...
| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Conference Paper |
| Language: | English |
| Published: |
2024
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/173637 |