Enhancing rework techniques in microelectronics components for reusability
The demand for smartphones, wearable devices, and Internet of Things applications has led to a trend in miniaturizing packages and printed circuit boards (PCB). Package-on-Package (PoP) components have risen in popularity due to their capability of stacking vertically on top of each other, enabli...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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Nanyang Technological University
2024
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| Online Access: | https://hdl.handle.net/10356/176023 |