Un-fill electronics packaging material
This project examines the methodologies used to weaken or remove underfill and allow for successful component desoldering from the Printed Circuit Board (PCB). With increasing usage of underfill to ensure solder joint reliability, especially for use in Integrated Circuit (IC) packaging such as Ball...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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Nanyang Technological University
2024
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| Online Access: | https://hdl.handle.net/10356/176057 |