Electromagnetic crosstalk isolation with transferred vertically aligned carbon nanotube arrays through thermocompression bonding
As electronic devices become smaller, more powerful, and operate at higher frequencies, electromagnetic compatibility (EMC) is becoming an ever-greater challenge due to the board real estate required for their proper operation. Thus, this paper presents a solution to augment existing electromagnetic...
| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2024
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/177988 |