Development of a new suction gripper for gripping under-constrained workpiece with minimized contact
When gripping delicate workpieces such as a silicon wafer, contact should be minimized to protect the workpiece. Some existing suction grippers can grip a workpiece with only three contact points on its upper surface, which is minimal to fully constrain the workpiece. Further reducing the contact po...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2024
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/179083 |