Mitigating the overheat of stretchable electronic devices via high-enthalpy thermal dissipation of hydrogel encapsulation

The practical application of flexible and stretchable electronics is significantly influenced by their thermal and chemical stability. Elastomer substrates and encapsulation, due to their soft polymer chains and high surface-area-to-volume ratio, are particularly susceptible to high temperatures and...

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Bibliografische gegevens
Hoofdauteurs: Cao, Can, Ji, Shaobo, Jiang, Ying, Su, Jiangtao, Xia, Huarong, Li, Haicheng, Tian, Changhao, Wong, Yi Jing, Feng, Xue, Chen, Xiaodong
Andere auteurs: School of Materials Science and Engineering
Formaat: Journal Article
Taal:English
Gepubliceerd in: 2024
Onderwerpen:
Online toegang:https://hdl.handle.net/10356/179294