Mitigating the overheat of stretchable electronic devices via high-enthalpy thermal dissipation of hydrogel encapsulation
The practical application of flexible and stretchable electronics is significantly influenced by their thermal and chemical stability. Elastomer substrates and encapsulation, due to their soft polymer chains and high surface-area-to-volume ratio, are particularly susceptible to high temperatures and...
| Hoofdauteurs: | , , , , , , , , , |
|---|---|
| Andere auteurs: | |
| Formaat: | Journal Article |
| Taal: | English |
| Gepubliceerd in: |
2024
|
| Onderwerpen: | |
| Online toegang: | https://hdl.handle.net/10356/179294 |