Mitigating the overheat of stretchable electronic devices via high-enthalpy thermal dissipation of hydrogel encapsulation
The practical application of flexible and stretchable electronics is significantly influenced by their thermal and chemical stability. Elastomer substrates and encapsulation, due to their soft polymer chains and high surface-area-to-volume ratio, are particularly susceptible to high temperatures and...
| Main Authors: | , , , , , , , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2024
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/179294 |
| _version_ | 1826114630131384320 |
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| author | Cao, Can Ji, Shaobo Jiang, Ying Su, Jiangtao Xia, Huarong Li, Haicheng Tian, Changhao Wong, Yi Jing Feng, Xue Chen, Xiaodong |
| author2 | School of Materials Science and Engineering |
| author_facet | School of Materials Science and Engineering Cao, Can Ji, Shaobo Jiang, Ying Su, Jiangtao Xia, Huarong Li, Haicheng Tian, Changhao Wong, Yi Jing Feng, Xue Chen, Xiaodong |
| author_sort | Cao, Can |
| collection | NTU |
| description | The practical application of flexible and stretchable electronics is significantly influenced by their thermal and chemical stability. Elastomer substrates and encapsulation, due to their soft polymer chains and high surface-area-to-volume ratio, are particularly susceptible to high temperatures and flame. Excessive heat poses a severe threat of damage and decomposition to these elastomers. By leveraging water as a high enthalpy dissipating agent, here, a hydrogel encapsulation strategy is proposed to enhance the flame retardancy and thermal stability of stretchable electronics. The hydrogel-based encapsulation provides thermal protection against flames for more than 10 s through the evaporation of water. Further, the stretchability and functions automatically recover by absorbing air moisture. The incorporation of hydrogel encapsulation enables stretchable electronics to maintain their functions and perform complex tasks, such as fire saving in soft robotics and integrated electronics sensing. With high enthalpy heat dissipation, encapsulated soft electronic devices are effectively shielded and retain their full functionality. This strategy offers a universal method for flame retardant encapsulation of stretchable electronic devices. |
| first_indexed | 2024-10-01T03:42:16Z |
| format | Journal Article |
| id | ntu-10356/179294 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T03:42:16Z |
| publishDate | 2024 |
| record_format | dspace |
| spelling | ntu-10356/1792942024-07-25T07:34:31Z Mitigating the overheat of stretchable electronic devices via high-enthalpy thermal dissipation of hydrogel encapsulation Cao, Can Ji, Shaobo Jiang, Ying Su, Jiangtao Xia, Huarong Li, Haicheng Tian, Changhao Wong, Yi Jing Feng, Xue Chen, Xiaodong School of Materials Science and Engineering Innovative Centre for Flexible Devices Max Planck-NTU Joint Laboratory for Artificial Senses Engineering Chemical stability Elastomers The practical application of flexible and stretchable electronics is significantly influenced by their thermal and chemical stability. Elastomer substrates and encapsulation, due to their soft polymer chains and high surface-area-to-volume ratio, are particularly susceptible to high temperatures and flame. Excessive heat poses a severe threat of damage and decomposition to these elastomers. By leveraging water as a high enthalpy dissipating agent, here, a hydrogel encapsulation strategy is proposed to enhance the flame retardancy and thermal stability of stretchable electronics. The hydrogel-based encapsulation provides thermal protection against flames for more than 10 s through the evaporation of water. Further, the stretchability and functions automatically recover by absorbing air moisture. The incorporation of hydrogel encapsulation enables stretchable electronics to maintain their functions and perform complex tasks, such as fire saving in soft robotics and integrated electronics sensing. With high enthalpy heat dissipation, encapsulated soft electronic devices are effectively shielded and retain their full functionality. This strategy offers a universal method for flame retardant encapsulation of stretchable electronic devices. Nanyang Technological University National Research Foundation (NRF) This work was supported by the National Research Foundation, Singapore(NRF) under NRF’s Medium Sized Centre of Singapore Hybrid-IntegratedNext-Generation μ-Electronics (SHINE) Centre funding programme, andCampus of Research Excellence and Technological Enterprise (CREATE),the Smart Grippers for Soft Robotics (SGSR) Program, the CollaborativeInnovation Center of Suzhou Nano Science and Technology, and SuzhouKey Laboratory of Surface and Interface Intelligent Matter (Grant No.SZS2022011). C.C. acknowledges the research scholarship awarded by theInstitute of Flexible Electronics Technology of Tsinghua, Zhejiang (IFET-THU), the Nanyang Technological University (NTU), and the QiantangScience and Technology Innovation Center, China (QSTIC). 2024-07-25T07:34:31Z 2024-07-25T07:34:31Z 2024 Journal Article Cao, C., Ji, S., Jiang, Y., Su, J., Xia, H., Li, H., Tian, C., Wong, Y. J., Feng, X. & Chen, X. (2024). Mitigating the overheat of stretchable electronic devices via high-enthalpy thermal dissipation of hydrogel encapsulation. Advanced Materials, 36(26), e2401875-. https://dx.doi.org/10.1002/adma.202401875 0935-9648 https://hdl.handle.net/10356/179294 10.1002/adma.202401875 38598692 2-s2.0-85190535139 26 36 e2401875 en Advanced Materials © 2024 Wiley-VCH GmbH. All rights reserved. |
| spellingShingle | Engineering Chemical stability Elastomers Cao, Can Ji, Shaobo Jiang, Ying Su, Jiangtao Xia, Huarong Li, Haicheng Tian, Changhao Wong, Yi Jing Feng, Xue Chen, Xiaodong Mitigating the overheat of stretchable electronic devices via high-enthalpy thermal dissipation of hydrogel encapsulation |
| title | Mitigating the overheat of stretchable electronic devices via high-enthalpy thermal dissipation of hydrogel encapsulation |
| title_full | Mitigating the overheat of stretchable electronic devices via high-enthalpy thermal dissipation of hydrogel encapsulation |
| title_fullStr | Mitigating the overheat of stretchable electronic devices via high-enthalpy thermal dissipation of hydrogel encapsulation |
| title_full_unstemmed | Mitigating the overheat of stretchable electronic devices via high-enthalpy thermal dissipation of hydrogel encapsulation |
| title_short | Mitigating the overheat of stretchable electronic devices via high-enthalpy thermal dissipation of hydrogel encapsulation |
| title_sort | mitigating the overheat of stretchable electronic devices via high enthalpy thermal dissipation of hydrogel encapsulation |
| topic | Engineering Chemical stability Elastomers |
| url | https://hdl.handle.net/10356/179294 |
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