Mitigating the overheat of stretchable electronic devices via high-enthalpy thermal dissipation of hydrogel encapsulation

Mitigating the overheat of stretchable electronic devices via high-enthalpy thermal dissipation of hydrogel encapsulation

The practical application of flexible and stretchable electronics is significantly influenced by their thermal and chemical stability. Elastomer substrates and encapsulation, due to their soft polymer chains and high surface-area-to-volume ratio, are particularly susceptible to high temperatures and...

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Bibliographic Details
Main Authors: Cao, Can, Ji, Shaobo, Jiang, Ying, Su, Jiangtao, Xia, Huarong, Li, Haicheng, Tian, Changhao, Wong, Yi Jing, Feng, Xue, Chen, Xiaodong
Other Authors: School of Materials Science and Engineering
Format: Journal Article
Language:English
Published: 2024
Subjects:
Engineering
Chemical stability
Elastomers
Online Access:https://hdl.handle.net/10356/179294

Internet

https://hdl.handle.net/10356/179294

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