High-gain and high-efficiency sub-terahertz antenna-on-chip with microbumps for highly-integrated systems

This article presents a novel high-gain antenna-on-chip (AoC) solution for the sub-terahertz band using a standard semiconductor and packaging process. The novel AoC is realized by bonding on a usual AoC in a semiconductor technology with a microbump in a flip-chip technology. As a result, an additi...

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Xehetasun bibliografikoak
Egile Nagusiak: Deng, Tianwei, Zhang, Yueping, Zheng, Ziyang, Yan, Qiaolin, Mao, Jun-Fa
Beste egile batzuk: School of Electrical and Electronic Engineering
Formatua: Journal Article
Hizkuntza:English
Argitaratua: 2024
Gaiak:
Sarrera elektronikoa:https://hdl.handle.net/10356/179430