High-gain and high-efficiency sub-terahertz antenna-on-chip with microbumps for highly-integrated systems
This article presents a novel high-gain antenna-on-chip (AoC) solution for the sub-terahertz band using a standard semiconductor and packaging process. The novel AoC is realized by bonding on a usual AoC in a semiconductor technology with a microbump in a flip-chip technology. As a result, an additi...
| Main Authors: | , , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2024
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/179430 |