Ultraflat Cu(111) foils by surface acoustic wave-assisted annealing

Ultraflat Cu(111) foils by surface acoustic wave-assisted annealing

Ultraflat metal foils are essential for semiconductor nanoelectronics applications and nanomaterial epitaxial growth. Numerous efforts have been devoted to metal surface engineering studies in the past decades. However, various challenges persist, including size limitations, polishing non-uniformiti...

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Bibliographic Details
Main Authors: Tian, Bo, Li, Junzhu, Wang, Qingxiao, Samad, Abdus, Yuan, Yue, Hedhili, Mohamed Nejib, Jangir, Arun, Gruenewald, Marco, Lanza, Mario, Schwingenschlögl, Udo, Fritz, Torsten, Zhang, Xixiang, Liu, Zheng
Other Authors: School of Materials Science and Engineering
Format: Journal Article
Language:English
Published: 2025
Subjects:
Engineering
Acoustic wave
Annealing
Online Access:https://hdl.handle.net/10356/182075

Internet

https://hdl.handle.net/10356/182075

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