Enhanced sample preparation of advanced semiconductor device package with microwave induced plasma
In recent years, heterogeneous integration has led to the development of semiconductor devices with higher performance and smaller form factor through advanced packaging technologies. These advanced packages are assembled with multiple dies and embedded components. They are normally encapsulated wit...
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| Format: | Thesis-Master by Research |
| Language: | English |
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Nanyang Technological University
2025
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| Online Access: | https://hdl.handle.net/10356/182241 |