| Summary: | This paper reviews the evolution of photolithography, from its origins with
Senefelder to modern technologies such as EUV, DUV, and EBL. Photolithography, a
complex multidisciplinary field, has continually advanced, with core factors
influencing resolution improvement identified through the study of these techniques.
Despite repetitive core technologies, understanding their differences and underlying
principles is essential for further progress. As the demand for miniaturization drives
nanotechnology, overcoming resolution limits in photolithography remains crucial.
Optimizing photoresist resolution while maintaining process stability and throughput
is key, especially in semiconductor manufacturing. This study focuses on optimizing
photolithography parameters to achieve high-resolution patterning for micro- and
nanofabrication applications. Through experiments on key steps like spin coating, soft
bake, exposure, and development, the paper highlights the importance of precise
process control and demonstrates the potential for enhancing positive photoresist
performance.
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