Development of carbon nanotubes for interconnection applications
This thesis records the development of carbon nanotubes (CNTs) material, fabrication techniques and process for interconnection application in very-large-scale integration (VLSI) and flip chip interconnects. For CNT to be used as VLSI interconnect, a self assembly fabrication technique for joining i...
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| Format: | Thesis |
| Language: | English |
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2009
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| Online Access: | https://hdl.handle.net/10356/18692 |