Non-conductive adhesives for micro joining in semiconductor interconnect applications
This work addresses the impact of NCA materials employed on the reliability performance of flip-chip package. Four commercially available non-conductive adhesives (NCAs), designed as NCA-A, NCA-B, NCA-C and NCA-D were investigated. The test vehicle used as a 4x4 mm, electroless Ni-Au bumped flip-ch...
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| Format: | Thesis |
| Language: | English |
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2009
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| Online Access: | http://hdl.handle.net/10356/19332 |