Investigation of flexible bellow for cooling isolated electronic components
The present work investigates the method of indirect liquid cooling employing a flexible bellow liquid heat sink sandwiched between two hot plates in electronic package. The scope of the project includes the formulation and development of a vertically averaged 2-D numerical model to simulate the hea...
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| Format: | Thesis |
| Language: | English |
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2009
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| Online Access: | http://hdl.handle.net/10356/19871 |