Investigation of flexible bellow for cooling isolated electronic components
The present work investigates the method of indirect liquid cooling employing a flexible bellow liquid heat sink sandwiched between two hot plates in electronic package. The scope of the project includes the formulation and development of a vertically averaged 2-D numerical model to simulate the hea...
Main Author: | |
---|---|
Other Authors: | |
Format: | Thesis |
Language: | English |
Published: |
2009
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/19871 |
_version_ | 1826114131981238272 |
---|---|
author | Zheng, Yun. |
author2 | Tou, Stephen Kwok Woon |
author_facet | Tou, Stephen Kwok Woon Zheng, Yun. |
author_sort | Zheng, Yun. |
collection | NTU |
description | The present work investigates the method of indirect liquid cooling employing a flexible bellow liquid heat sink sandwiched between two hot plates in electronic package. The scope of the project includes the formulation and development of a vertically averaged 2-D numerical model to simulate the heat and fluid flow phenomena in the bellow. The numerical model applies the finite volume method on a staggered grid. Solutions are obtained using the TDMA (TriDiagonal-Matrix Algorithm) and pressure-velocity correction technique. The numerical model is assessed by experimental work in a previous study and is found to be in fair agreement. |
first_indexed | 2024-10-01T03:34:10Z |
format | Thesis |
id | ntu-10356/19871 |
institution | Nanyang Technological University |
language | English |
last_indexed | 2024-10-01T03:34:10Z |
publishDate | 2009 |
record_format | dspace |
spelling | ntu-10356/198712023-03-11T17:00:13Z Investigation of flexible bellow for cooling isolated electronic components Zheng, Yun. Tou, Stephen Kwok Woon School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing The present work investigates the method of indirect liquid cooling employing a flexible bellow liquid heat sink sandwiched between two hot plates in electronic package. The scope of the project includes the formulation and development of a vertically averaged 2-D numerical model to simulate the heat and fluid flow phenomena in the bellow. The numerical model applies the finite volume method on a staggered grid. Solutions are obtained using the TDMA (TriDiagonal-Matrix Algorithm) and pressure-velocity correction technique. The numerical model is assessed by experimental work in a previous study and is found to be in fair agreement. Master of Engineering (MPE) 2009-12-14T06:59:31Z 2009-12-14T06:59:31Z 1996 1996 Thesis http://hdl.handle.net/10356/19871 en NANYANG TECHNOLOGICAL UNIVERSITY 118 p. application/pdf |
spellingShingle | DRNTU::Engineering::Manufacturing Zheng, Yun. Investigation of flexible bellow for cooling isolated electronic components |
title | Investigation of flexible bellow for cooling isolated electronic components |
title_full | Investigation of flexible bellow for cooling isolated electronic components |
title_fullStr | Investigation of flexible bellow for cooling isolated electronic components |
title_full_unstemmed | Investigation of flexible bellow for cooling isolated electronic components |
title_short | Investigation of flexible bellow for cooling isolated electronic components |
title_sort | investigation of flexible bellow for cooling isolated electronic components |
topic | DRNTU::Engineering::Manufacturing |
url | http://hdl.handle.net/10356/19871 |
work_keys_str_mv | AT zhengyun investigationofflexiblebellowforcoolingisolatedelectroniccomponents |