Investigation of flexible bellow for cooling isolated electronic components

The present work investigates the method of indirect liquid cooling employing a flexible bellow liquid heat sink sandwiched between two hot plates in electronic package. The scope of the project includes the formulation and development of a vertically averaged 2-D numerical model to simulate the hea...

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Bibliographic Details
Main Author: Zheng, Yun.
Other Authors: Tou, Stephen Kwok Woon
Format: Thesis
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/19871
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author Zheng, Yun.
author2 Tou, Stephen Kwok Woon
author_facet Tou, Stephen Kwok Woon
Zheng, Yun.
author_sort Zheng, Yun.
collection NTU
description The present work investigates the method of indirect liquid cooling employing a flexible bellow liquid heat sink sandwiched between two hot plates in electronic package. The scope of the project includes the formulation and development of a vertically averaged 2-D numerical model to simulate the heat and fluid flow phenomena in the bellow. The numerical model applies the finite volume method on a staggered grid. Solutions are obtained using the TDMA (TriDiagonal-Matrix Algorithm) and pressure-velocity correction technique. The numerical model is assessed by experimental work in a previous study and is found to be in fair agreement.
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spelling ntu-10356/198712023-03-11T17:00:13Z Investigation of flexible bellow for cooling isolated electronic components Zheng, Yun. Tou, Stephen Kwok Woon School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing The present work investigates the method of indirect liquid cooling employing a flexible bellow liquid heat sink sandwiched between two hot plates in electronic package. The scope of the project includes the formulation and development of a vertically averaged 2-D numerical model to simulate the heat and fluid flow phenomena in the bellow. The numerical model applies the finite volume method on a staggered grid. Solutions are obtained using the TDMA (TriDiagonal-Matrix Algorithm) and pressure-velocity correction technique. The numerical model is assessed by experimental work in a previous study and is found to be in fair agreement. Master of Engineering (MPE) 2009-12-14T06:59:31Z 2009-12-14T06:59:31Z 1996 1996 Thesis http://hdl.handle.net/10356/19871 en NANYANG TECHNOLOGICAL UNIVERSITY 118 p. application/pdf
spellingShingle DRNTU::Engineering::Manufacturing
Zheng, Yun.
Investigation of flexible bellow for cooling isolated electronic components
title Investigation of flexible bellow for cooling isolated electronic components
title_full Investigation of flexible bellow for cooling isolated electronic components
title_fullStr Investigation of flexible bellow for cooling isolated electronic components
title_full_unstemmed Investigation of flexible bellow for cooling isolated electronic components
title_short Investigation of flexible bellow for cooling isolated electronic components
title_sort investigation of flexible bellow for cooling isolated electronic components
topic DRNTU::Engineering::Manufacturing
url http://hdl.handle.net/10356/19871
work_keys_str_mv AT zhengyun investigationofflexiblebellowforcoolingisolatedelectroniccomponents