Cost modeling of multichip modules substrates technology in concurrent engineering
Choosing and developing advance electronic packaging technology to meet product needs often carry ill-affordable alternatives late into the decision process. During the concept exploration and defmition (CE & D) phase of products and its manufacturing processes, designers must be able to assess...
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| Định dạng: | Luận văn |
| Ngôn ngữ: | English |
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2009
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| Truy cập trực tuyến: | http://hdl.handle.net/10356/19915 |