Development of an alternative rework process for ceramic ball grid array 256 (CBGA256) assembly
In the assembly of ceramic ball grid array (CBGA) packages to a printed circuit board, various factors could affect the functionality of the package. A rework operation which removes and replaces the defective component is thus required. However, the deficiency of the site preparation has become the...
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| Format: | Thesis |
| Language: | English |
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2009
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| Online Access: | http://hdl.handle.net/10356/19926 |