Evaluation of process requirements for room temperature direct copper bonding
Direct metal bonding is a method of joining two metal surfaces under ambient conditions without an intermediate layer in between. In this thesis, by coating the copper surface with a self assembled monolayer of alkanethiol prior to bonding, Cu joints can be successfully formed at room temperature in...
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| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2009
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| Online Access: | http://hdl.handle.net/10356/20415 |